positive vibration
16-04-2003, 01:13:37
Detalhes oficiais do NV35:
- CineFX ( TM ) Shading Architecture
- Support for the Microsoft DirectX® 9.0 Pixel Shader 2.0
- Support for the DirectX 9.0 Vertex Shader 2.0
- Long pixel programs up to 1,024 instructions
- Long vertex programs up to 256 static instructions with up to 65,536 instructions executed
- Dynamic, conditional execution and flow control
- 256-bit advanced memory interface combines a wider memory data path with next generation controller technology for superior performance and throughput.
- Full 128-bit, studio-quality floating point precision through the entire rendering pipeline with native hardware support for 32 bpp, 64 bpp and 128 bpp rendering modes
- Accelerated pixel shaders allow for up to 12 pixel shader operations/clock
- Up to 16 textures per rendering pass
- Support for sRGB texture format for gamma textures
- IntellisampleTM performance technology, a Hi-Res compression technology (HCT), increases performance at higher resolutions through advances in compression and anti-aliasing technology.
- Shadow Volume Accelerator – accelerates shadow volumes by maintaining them more accurately and discarding useless information.
- Full nViewTM multi-display technology capability
- Integrated NTSC/PAL TV encoder supporting resolutions up to 1024x768 without the need for panning with built-in Macrovision copy protection
- Microsoft® Video Mixing Renderer (VMR) creates support for multiple video windows with full video quality and features in each window
- DVD and HDTV-ready MPEG-2 decoding up to 1920 × 1080i resolutions
- Dual, integrated 400 MHz RAMDACs for display resolutions up to and including 2048 × 1536 @ 85 Hz
- Dual DVO ports for interfacing to external TMDS transmitters and external TV encoders
- Dual internal TMDS encoders (one single and one Dual link) able to drive next-generation flat panel displays with resolutions greater than 1600 × 1200
- Digital Vibrance Control 3.0
- 0.13 micron process technology for higher levels of integration and higher operating clock speeds
- 40 mm × 40 mm, BGA 1309 flip-chip package
- Comprehensive Microsoft DirectX® 9.0 (and lower) and OpenGL 1.4 (and earlier) support
- DirectX and S3TC texture compression
- CineFX ( TM ) Shading Architecture
- Support for the Microsoft DirectX® 9.0 Pixel Shader 2.0
- Support for the DirectX 9.0 Vertex Shader 2.0
- Long pixel programs up to 1,024 instructions
- Long vertex programs up to 256 static instructions with up to 65,536 instructions executed
- Dynamic, conditional execution and flow control
- 256-bit advanced memory interface combines a wider memory data path with next generation controller technology for superior performance and throughput.
- Full 128-bit, studio-quality floating point precision through the entire rendering pipeline with native hardware support for 32 bpp, 64 bpp and 128 bpp rendering modes
- Accelerated pixel shaders allow for up to 12 pixel shader operations/clock
- Up to 16 textures per rendering pass
- Support for sRGB texture format for gamma textures
- IntellisampleTM performance technology, a Hi-Res compression technology (HCT), increases performance at higher resolutions through advances in compression and anti-aliasing technology.
- Shadow Volume Accelerator – accelerates shadow volumes by maintaining them more accurately and discarding useless information.
- Full nViewTM multi-display technology capability
- Integrated NTSC/PAL TV encoder supporting resolutions up to 1024x768 without the need for panning with built-in Macrovision copy protection
- Microsoft® Video Mixing Renderer (VMR) creates support for multiple video windows with full video quality and features in each window
- DVD and HDTV-ready MPEG-2 decoding up to 1920 × 1080i resolutions
- Dual, integrated 400 MHz RAMDACs for display resolutions up to and including 2048 × 1536 @ 85 Hz
- Dual DVO ports for interfacing to external TMDS transmitters and external TV encoders
- Dual internal TMDS encoders (one single and one Dual link) able to drive next-generation flat panel displays with resolutions greater than 1600 × 1200
- Digital Vibrance Control 3.0
- 0.13 micron process technology for higher levels of integration and higher operating clock speeds
- 40 mm × 40 mm, BGA 1309 flip-chip package
- Comprehensive Microsoft DirectX® 9.0 (and lower) and OpenGL 1.4 (and earlier) support
- DirectX and S3TC texture compression